Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints

Author:

Li Z.L.,Cheng L.X.,Li G.Y.,Huang J.H.,Tang Y.

Funder

Planned Science and Technology Project of Guangdong Province, China

Natural Science Foundation of Guangdong, China

Pearl River S&T Nova Program of Guangzhou, China

Outstanding Young Teacher Project of Guangdong High School, China

Characteristics and Innovations Project of Guangdong High School, China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference33 articles.

1. A study of inter-metallic compounds (IMC) formation and growth in ultra-fine pitch Sn-Ag-Cu lead-free solder joints;Salan;Electron. Syst. Technol. Conf. Dresd.,2006

2. Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint;Li;IEEE Trans. Compon. Packag. Technol.,2003

3. Size and volume effects in microscale solder joint of electronic packaging;Yin;Int. Conf. Electron. Packag. Technol. High Density Packag.,2011

4. Influence of dopant on growth of intermetallic layers in Sn-Ag-Cu solder joints;Li;J. Electron. Mater.,2011

5. Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn-3.0Ag-0.5Cu-xTiO2 composite solder;Tang;Mater. Des.,2014

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