Effect of creep annealing on the dimensional stability of dispersion strengthened copper alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference41 articles.
1. High temperature mechanical behavior of alumina dispersion strengthened copper alloy with high content of alumina;Xiang;Trans. Nonferr. Met. Soc. China,2015
2. Vacuum requirements in high power microwave tubes;Dammertz;Vacuum,1995
3. Synthesis of nano TiB2 particles in copper matrix by in situ reaction of double-beam melts;Guo;J. Alloy. Compd.,2008
4. Effects of thermal treatments on the residual stress and micro-yield strength of Al2O3 dispersion strengthened copper alloy;Xiao;J. Alloy. Compd.,2019
5. Fabrication and characterization of Y2O3 dispersion strengthened copper alloys;Carro;J. Nucl. Mater.,2014
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