Evolution of microstructure and residual stress for a lead-frame Cu-2.13Fe-0.026 P (wt%) alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference73 articles.
1. Effects of silicon and thermo-mechanical process on microstructure and properties of Cu-10Ni-3Al-0.8Si alloy;Shen;Mater. Des. (1980-2015) 62,2014
2. Effect of deformation and aging treatment on the microstructure and properties of Cu-0.45Cr-0.14Ti (wt%) alloy;Zhang;J. Alloy. Compd.,2021
3. Effect of particle/matrix interfacial character on the high-temperature deformation and recrystallization behavior of Cu with dispersed Fe particles;Miura;Acta Mater.,2008
4. Diffraction analysis of α-Fe precipitates in a polycrystalline Cu-Fe alloy;Dong;Mater. Charact.,2015
5. Microstructure evolution and deformation behaviour of Cu-10 wt%Fe alloy during cold rolling;Wang;Mater. Sci. Eng.: A,2021
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Surface residual stress in H-section steel beams processed by quenching and self-tempering using instrumented indentation testing;Journal of Materials Research and Technology;2024-09
2. Influences of deformation defects on etching behaviors of high-strength and high-conductivity Cu alloy for lead frame;Microelectronics Reliability;2024-08
3. A novel Cu-Sn-Zr alloy with core-shell structure;Materials Science and Engineering: A;2024-03
4. Enhanced high-temperature mechanical properties of the Cu–1.16Ni–0.36Cr alloy owing to interactions between metastable precipitates and dislocations;Journal of Materials Research and Technology;2024-03
5. Heat treatment effects on microstructure and properties of Cu–Ti–Fe alloys;Materials Science and Engineering: A;2024-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3