Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration
Author:
Funder
Ministry of Science and Technology of the Republic of China
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference50 articles.
1. Solid-solution copper alloys with high strength and high electrical conductivity;Maki;Scripta Mater.,2013
2. Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints;Shin;J. Electron. Mater.,2001
3. Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers;Domenicucci;J. Appl. Phys.,1996
4. Nfluence of solute additions on electromigration in aluminum;Kim;Mater. Res. Soc. Symp. Proc.,1996
5. Influence of rapid solidification on microstructure, thermodynamic characteristic and the mechanical properties of solder/Cu joints of Sn-9Zn alloy;Jing;Mater. Des.,2013
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