Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux-Reference-Cited by-同舟云学术

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Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux

Published:2015-03 Issue: Volume:626 Page:391-400
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Shu Yang,Rajathurai Karunaharan,Gao Fan,Cui Qingzhou,Gu Zhiyong

Funder

U.S. National Science Foundation

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference32 articles.

1. Principles of Soldering;Humpston,2004

2. Principles of Electronic Packaging;Seraphim,1989

3. Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

4. A review of mechanical properties of lead-free solders for electronic packaging

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