Influence of thermal cycling on shear strength of Cu–Sn3.5AgIn–Cu joints with various content of indium
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
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1. Proceedings COST 531 Action: Lead-free Solder Materials. Mid-Term Meeting;Ipser,2006
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4. The Surface Tension and Density of Liquid Ag–Bi, Ag–Sn, and Bi–Sn Alloys
5. Phase Diagrams of Pb-Free Solders and their Related Materials Systems
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