Research and development of lead-free solder for microelectronics in consideration of the environmental and qualitative aspects

Author:

Hodúlová Erika,Šimeková Beáta,Kovaříková Ingrid,Lechovič Emil,Ulrich Koloman

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference17 articles.

1. Metal Prices all metal prices [online]. [cit. 2010-01-10]. http://www.metalprices.com/

2. Laurila T (2010) Impurity and alloying effects on interfacial reaction layers in Pb-free soldering. Mater Sci Eng. R: Reports, Corrected Proof

3. Rizvi JM (2005) Effect of alloying elements on properties and microstructures of SnAgCu solders. J Electron Mater 34:1115–1122. [cit. 20.01.2011]. Dostupné na internete http://www.scopus.com/

4. Šebo P (2008) Influence of thermal cycling on shear strength of Cu–Sn3.5AgIn–Cu joints with various content of indium. J Alloys Compd 463(1–2):168–172, Elsevier Science

5. Cheng MD (2004) Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid array packages. J Electron Mater 33(3):71–180 [cit. 20.05.2011]. http://www.scopus.com/ . ISSN 03615235

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