Effect of the addition of In on the microstructural formation of Sn–Ag–Zn lead-free solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. Thermodynamic optimization of the lead-free solder system Bi–In–Sn–Zn
2. Lead‐free alloys
3. Proceedings of the Fifth Symposium on Microjointing and Assembly Technology in Electronics;Hirano,1999
4. Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations
5. Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages
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2. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review;Journal of Materials Science: Materials in Electronics;2021-12-01
3. Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement;Applied Mechanics and Materials;2015-04
4. Development of SnAg-based lead free solders in electronics packaging;Microelectronics Reliability;2012-03
5. Development of a lead‐free solder: Sn‐4.0Bi‐3.7Ag‐0.9Zn;Soldering & Surface Mount Technology;2011-02-08
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