Development of a lead‐free solder: Sn‐4.0Bi‐3.7Ag‐0.9Zn-Reference-Cited by-同舟云学术

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Development of a lead‐free solder: Sn‐4.0Bi‐3.7Ag‐0.9Zn

Published:2011-02-08 Issue:1 Volume:23 Page:15-21
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Wang Xun,Liu Yongchang,Yu Liming,Dong Zhizhong,Gao Zhiming

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference35 articles.

1. Lead-free Solders in Microelectronics

2. Mechanical characterization of Sn–Ag-based lead-free solders

3. The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad

4. Phase Diagrams of Pb-Free Solders and their Related Materials Systems

5. Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint

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