Investigation of amorphous Ni–Al–N film as diffusion barrier between Cu and SiO2-Reference-Cited by-同舟云学术

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Investigation of amorphous Ni–Al–N film as diffusion barrier between Cu and SiO2

Published:2011-08 Issue:31 Volume:509 Page:8093-8096
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Liu B.T.,Chen J.H.,Li X.H.,Wang K.M.,Li M.,Zhao D.Y.,Yang L.,Zhao Q.X.,Ma L.X.,Zhang X.Y.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference22 articles.

1. Deposition of Conformal Copper and Nickel Films from Supercritical Carbon Dioxide

2. Resistivity of thin Cu films with surface roughness

3. Characteristics of sputtered Ta–B–N thin films as diffusion barriers between copper and silicon

4. Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallization

5. Properties of W–Ge–N as a diffusion barrier material for Cu

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Atomic diffusion and electrical reliability of NiAl/SiO2 interconnect: Breakdown voltage and TDDB characteristics;Journal of Materials Research and Technology;2024-05

2. Thermodynamic route for self-forming 1.5 nm V-Nb-Mo-Ta-W high-entropy alloy barrier layer: Roles of enthalpy and mixing entropy;Acta Materialia;2020-10

3. Thermal stability of RuZr alloy thin films as the diffusion barrier in Cu metallization;Journal of Alloys and Compounds;2014-03

4. Growing process and reaction mechanism of electroless Ni–Mo–P film on SiO2 substrate;Transactions of Nonferrous Metals Society of China;2013-12

5. Improvement of Zr-N Diffusion Barrier Performance in Cu Metallization by Insertion of a Thin Zr Layer;Applied Mechanics and Materials;2013-08

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