Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn

Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn–Pd/Ni system

Published:2011-07 Issue:29 Volume:509 Page:7749-7757
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Ho Cheng-En,Lin Sheng-Wei,Lin Yen-Chen

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference32 articles.

1. Lead-Free Soldering;Roberts,2007

2. Proceedings of the 5th International Microsystems Packaging Assembly and Circuits Technology (IMPACT) Conference and International 3D IC Conference;Kao,2010

3. Solder Joint Technology: Materials, Properties, and Reliability;Tu,2007

4. Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates

5. Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

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