Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference25 articles.
1. Lead-free Solders in Microelectronics
2. The mechanical behavior of interconnect materials for electronic packaging
3. Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints
4. Spalling of Cu6Sn5spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
5. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
Cited by 93 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of thermal exposure on microstructure, orientation relationship, residual stress and failure mechanism of ultrasonic-assisted Kovar/SnSb10/Kovar joints;Materials Characterization;2024-01
2. Snagcu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux;2024
3. Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times;Nanomaterials;2023-10-23
4. Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process;Journal of Materials Science: Materials in Electronics;2023-06
5. Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3