Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference44 articles.
1. Effect of high-temperature annealing on the microstructural formation of Sn–3.7Ag–0.9Zn–xAl lead-free solder
2. Effect of thermal-shearing cycling on Ag3Sn microstructural coarsening in SnAgCu solder
3. Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry
4. Cu-Ni-Sn: A Key System for Lead-Free Soldering
5. Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface
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1. Efficient thermodynamic modelling with uncertainty quantification of the Ag–Cu–Co system from its sub-binary systems;Materials Chemistry and Physics;2023-10
2. Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder;Microelectronics Reliability;2023-01
3. Co/(Ag-41.0 at.%Sb)1−xCox and Ni/(Ag-41.0 at.%Sb)1−xNix Interfacial Reactions;Journal of Electronic Materials;2019-06-25
4. Energetics of cobalt alloys and compounds and solute–vacancy binding in fcc cobalt: A first-principles database;Acta Materialia;2017-02
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