The shearing behavior and microstructure of Sn–4Ag–0.5Cu solder joints on a Ni–P–carbon nanotubes composite coating
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference13 articles.
1. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
2. Shearing tests of solder joints on tape ball grid array substrates
3. Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization
4. Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows
5. Solder joint reliability of plastic ball grid array packages
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1. The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction;Metals;2022-07-25
2. Fabrication of Metal/Carbon Nanotube Composites by Electrochemical Deposition;Electrochem;2021-10-21
3. Microstructure and mechanical properties of nano-carbon reinforced Cu-based powder metallurgy friction materials produced by hot isostatic pressing;Materials Testing;2018-09-30
4. Reinforced solder joint performance by incorporation of ZrO2 nanoparticles in electroless Ni–P composite layer;Journal of Materials Research;2014-11-17
5. Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing;Journal of Alloys and Compounds;2014-05
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