Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference29 articles.
1. Lead-free Solders in Microelectronics
2. Characterization of eutectic Sn-Bi solder joints
3. Intermetallic compound formation at Sn–3.0Ag–0.5Cu–1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions
4. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
5. IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms
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1. Effect of thermal aging on joint with eutectic SnIn solder by TLP bonding;Materials Science in Semiconductor Processing;2025-01
2. Low-temperature phase equilibria of the ternary Cu-In-Sn system at In-rich corner;Materialia;2024-08
3. Effect of CuZnAl particle addition on the microstructure and shear property of Cu/In-48Sn/Cu solder joints by transient liquid phase bonding;Welding in the World;2023-11-13
4. Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows;Journal of Materials Research and Technology;2023-09
5. Combined Effect of In and Ce on Microstructure and Properties of Ag10CuZnSn Low-Silver Brazing Filler Metals;Crystals;2023-08-20
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