Electroless multilayer coatings on aluminium–silicon carbide composites for electronics packaging
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Ceramics and Composites
Reference8 articles.
1. High performance packaging materials for improved thermal managements of power electronic;Moores;Future Circuits Int.,2001
2. Copper alloy-impregnated carbon–carbon hybrid composites for electronic packaging applications;Datta;Metall. Mater. Trans. A,1999
3. Properties of high reinforcement-content aluminum matrix composite for electronic packages;Wu;J. Mater. Sci. Mater. Electron.,2003
4. A comparison of aluminium-based metal-matrix composites reinforced with coated and uncoated particulate silicon carbide;Davidson;Compos. Sci. Technol.,2000
5. Adhesion improvements of electroless plated Ni layer by ultrasonic agitation during zincating process;Jin;Thin Solid Films,2004
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