Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications-Reference-Cited by-同舟云学术

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Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications

Published:1999-01 Issue:1 Volume:30 Page:175-181
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Datta S. K.,Tewari S. N.,Gatica J. E.,Shih W.,Bentsen L.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-999-0205-7.pdf

Reference10 articles.

1. Metals Handbook, 9th ed., ASM, Materials Park, OH, vol. 3, 1980.

2. C.Z. Zweben: J. Met., 1992, vol. 44 (7), pp. 15–23.

3. M.K. Premkumar, W.H. Hunt, Jr., and R.R. Sawtell: J. Met., 1992, vol. 44 (7), pp. 24–29.

4. Advanced Materials and Processes, 1995, Oct., p. 8.

5. D. Maass and M. Makwinski: 6th Int. SAMPE Electronicsference, Honolulu, HI. June 22–25, 1992.

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