Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process-Reference-Cited by-同舟云学术

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Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process

Published:2004-11 Issue:1-2 Volume:466 Page:272-278
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Jin Jeong-Gi,Lee Sung-Ki,Kim Young-Ho

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Multichip Module Technologies and Alternatives: The Basics,1993

2. Flip Chip Technologies;Zakel,1996

3. Flip Chip Technologies;Sharma,1996

4. Proceedings of the Twenty-fourth IEEE/CPMT International Electronic Manufacturing Technology Symposium, Austin, U.S.A., October 18–19;Lu,1999

5. Influence of bath chemistry on zincate morphology on aluminum bond pad

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