Silicon–glass wafer bonding with silicon hydrophilic fusion bonding technology-Reference-Cited by-同舟云学术

Silicon–glass wafer bonding with silicon hydrophilic fusion bonding technology

Published:1999-01 Issue:1 Volume:72 Page:46-48
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Xiao Zhi-Xiong,Wu Guo-Ying,Li Zhi-Hong,Zhang Guo-Bing,Hao Yi-Long,Wang Yang-Yuan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Field assisted glass–metal sealing;Wallis;J. Appl. Phys.,1969

2. New application of r.f.-sputtered glass films as protection and bonding layers in silicon micromachining;Berenschot;Sensors and Actuators A,1994

3. Characterization of the electrostatic bonding of silicon and Pyrex glass;Cozma;J. Micromech. Microeng.,1995

4. Integrated silicon capacitive accelerometer with PLL servo technique;Matsumoto;Sensors and Actuators A,1993

5. Substrate bonding techniques for CMOS Processed wafers;Van der Groen;J. Micromech. Microeng.,1997

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