New applications of r.f.-sputtered glass films as protection and bonding layers in silicon micromachining-Reference-Cited by-同舟云学术

New applications of r.f.-sputtered glass films as protection and bonding layers in silicon micromachining

Published:1994-04 Issue:1-3 Volume:41 Page:338-343
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Berenschot J.W.,Gardeniers J.G.E.,Lammerink T.S.J.,Elwenspoek M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference12 articles.

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4. Low temperature electrostatic Si-to-Si seals using sputtered borosilicate glass;Brooks;J. Electrochem. Soc.,1972

5. Low temperature silicon-to-silicon bonding with intermediate low melting point glass;Esashi;Sensors and Actuators,1990

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