Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation-Reference-Cited by-同舟云学术

Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation

Published:2002-02 Issue:2-3 Volume:96 Page:152-156
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Chen Jing,Liu Litian,Li Zhijian,Tan Zhimin,Jiang Qianshao,Fang Huajun,Xu Yang,Liu Yanxiang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Bulk micromachining of silicon;Kovacs;Proc. IEEE,1998

2. Comparative studies of TMAH and KOH for anisotropic etching of silicon;Zaracky;Electrochem. Soc. Proc.,1997

3. Roughening of single-crystal silicon surface etched by KOH water;Sato;Sens. Actuators A,1999

4. Differences in anisotropic etching properties of KOH and TMAH solutions;Shikida;Sens. Actuators A,2000

5. Etching roughness for (1 0 0) silicon surfaces in aqueous KOH;Palik;J. Appl. Phys.,1991

Cited by 47 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multistage anisotropic wet etching by KOH for MEMS/NEMS structures;Novel Patterning Technologies 2024;2024-04-09

2. Enhanced etching characteristics of Si{100} in NaOH-based two-component solution;Micro and Nano Systems Letters;2022-08-01

3. Alkaline Texturing;Photovoltaic Manufacturing;2021-08-12

4. High speed silicon wet anisotropic etching for applications in bulk micromachining: a review;Micro and Nano Systems Letters;2021-02-22

5. A novel silicon etching method using vapor of tetramethylammonium hydroxide solution;Chinese Journal of Chemical Physics;2020-12