Physical and chemical analysis of advanced interconnections using energy filtering transmission electron microscopy-Reference-Cited by-同舟云学术

Physical and chemical analysis of advanced interconnections using energy filtering transmission electron microscopy

Published:2000-01 Issue:1-4 Volume:50 Page:277-284
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Pantel R,Torres J,Paniez P,Auvert G

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. TEM sample preparation using a focused ion beam and a probe manipulator;Herlinger,1996

2. Focused ion beam sample preparation. Transmission electron microscopy and electron energy loss spectroscopy analysis of advanced CMOS silicon technology interconnections;Pantel;Microelectr. Eng.,1997

3. Energy-filtering Transmission Electron Microscopy;Reimer,1995

4. Application of electron spectroscopic imaging in materials science;Hofer;Eur. Microsc. Anal.,1995

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