Author:
Chu Paul Wing-Po,Chong Chi-Po,Chan Helen Lai-Wa,Ng Kelvin Ming-Wai,Liu Peter Chou-Kee
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Ultrasonic wire-bond quality monitoring using piezoelectric sensor
2. Sensors for ultrasonic wire bonding process control
3. H.L.W. Chan, S.W. Or, C.L. Choy, Ultrasonic Transducers, US Patent 6,286,747 B1 (2001).
4. H.L.W. Chan, S.S. Chiu, S.W. Or, Y.M. Cheung, Piezoelectric Sensor for Measuring Bonding Parameters, US Patent 6,279,810 B1 (2001).
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16 articles.
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