1. The changing philosophy of reliability;Young;Microelectr Reliab,1970
2. Ohring M. Reliability and failure of electronic materials and devices. 1998. books.google.com.
3. The quality and reliability of intel’s quarter micron process;Seshan;Intel Technol J Q3’98,1998
4. Im S, Srivastava N, Banerjee K, Goodson KE. Thermal scaling analysis of multilevel Cu/Low-k interconnect structures in deep nanometer scale technologies. Proc. 22nd Intl. VLSI Multilevel Interconnect Conference (VMIC), Oct. 3–6, Fremont, CA, pp. 525–530, 2005.
5. Physically based models of electromigration: From Black’s equation to modern TCAD models