Applications of chemical mechanical planarization (CMP) to More than Moore devices-Reference-Cited by-同舟云学术

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Applications of chemical mechanical planarization (CMP) to More than Moore devices

Published:2022 Issue: Volume: Page:533-557
ISSN:
Container-title:Advances in Chemical Mechanical Planarization (CMP)
language:
Short-container-title:

Author:

Zwicker G.

Publisher

Elsevier

Reference13 articles.

1. ITRS, “More-than-Moore” White Paper;Arden,2010

2. Chemical mechanical polishing as enabling technology for sub-14nm logic device;Moon,2014

3. Chemical-mechanical polishing enhancing the manufacturability of MEMS;Sniegowski;Proc. SPIE,1996

4. Processing tools for manufacturing;Tsujimura,2008

5. Application of an abrasive-free Cu slurry for MEMS devices;Steible,2012

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. III-V material-based junction-free L-shaped gate normal line tunneling FET for improved performance;Semiconductor Science and Technology;2024-08-07

2. Engineering SiO<sub>2</sub> Nanoparticles: A Perspective on Chemical Mechanical Planarization Slurry for Advanced Semiconductor Processing;KONA Powder and Particle Journal;2023

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