Chemical-mechanical polishing: enhancing the manufacturability of MEMS
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SPIE
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Synergistic effect of aminosilane and K2CO3 on improving Chemical Mechanical Polishing performance of SiO2 dielectric layer;Materials Science in Semiconductor Processing;2022-08
2. Applications of chemical mechanical planarization (CMP) to More than Moore devices;Advances in Chemical Mechanical Planarization (CMP);2022
3. Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization;Materials Science in Semiconductor Processing;2021-06
4. Reactive Liquids for Non–Prestonian Chemical Mechanical Polishing of Polysilicon Films;ECS Journal of Solid State Science and Technology;2019
5. A Novel Application of Chemical Mechanical Polishing for Panel Level Organic and Glass Substrate;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05
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