Destructive and non-destructive evaluation of copper diffusion bonds

Author:

Suresh Kumar S.ORCID,Ravisankar B.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference24 articles.

1. Microstructural evaluation of 410 SS/Cu diffusion-bonded joint;Sabetghadam;J Mater Sci Technol,2010

2. Evaluation of mechanical quality of field-assisted diffusion bonding by ultrasonic non-destructive method;Cao;Sens Actuators A,2005

3. The application of diffusion welding to aircraft titanium alloys;Ohsumi;Trans ISIJ,1985

4. Non-destructive testing of bonded structures for plasma facing components;Onozuka;Fusion Eng Des,2005

5. Methodology to evaluate the quality of diffusion bonded joints by ultrasonic method;Suresh Kumar;Indian J Eng Mater Sci,2009

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