Mechanical and ultrasonic characterisation of copper-nickel diffusion bonded joints-Reference-Cited by-同舟云学术

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Mechanical and ultrasonic characterisation of copper-nickel diffusion bonded joints

Published:2020-12-20 Issue: Volume: Page:1-15
ISSN:2374-068X
Container-title:Advances in Materials and Processing Technologies
language:en
Short-container-title:Advances in Materials and Processing Technologies

Author:

Kumar S. Suresh¹,Padmapreetha R.²,Ravisankar B.³

Affiliation:

1. Department of Mechanical Engineering, Saveetha School of Engineering, Saveetha Institute of Medical and Technical Sciences , Chennai, India

2. Department of Metallurgical Engineering, PSG College of Technology , Coimbatore, India

3. Department of Metallurgical and Materials Engineering, National Institute of Technology , Tiruchirappalli, India

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1080/2374068X.2020.1860589

Reference26 articles.

1. Microstructural Evaluation of 410 SS/Cu Diffusion-Bonded Joint

2. Influence of Diffusion Mechanisms in Aluminium Solid-state Welding Processes

3. Effect of Welding Time on the Joining Phenomena of Diffusion Welded Joint between Aluminum Alloy and Stainless Steel

4. Investigation of the effect of diffusion bonding parameters on microstructure and mechanical properties of 7075 aluminium alloy

5. Interfacial microstructure and mechanical properties of diffusion-bonded titanium–stainless steel joints using a nickel interlayer

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Quantitative determination of the defects in TC4 diffusion bonded joints via ultrasonic C-scan;Journal of Manufacturing Processes;2021-04

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