Nonlinear Ultrasonic C-Scan Imaging for Contact-Type Defects in Diffusion-Bonded Joints—A Case Study

Abstract

Diffusion bonding technology is widely used in the connection of precision components, yet accurately and reliably detecting contact-type defects on the bond interface still remains a significant problem. Nonlinear ultrasonic methods have been proven to be sensitive to contact-type defects; however, the use of continuous wave or tone burst wave excitation limits its wider application. In this paper, dual-probe nonlinear ultrasonic testing with pulse wave excitation is proposed to detect contact-type defects in diffusion-bonded joints. A titanium alloy diffusion-bonded specimen with artificial defects was fabricated, and the corresponding detection device was designed based on the existing ultrasonic C-scan testing system. A C-scan imaging program based on nonlinear parameters was developed by extracting the fundamental and second harmonic waves of the reflection echo on the bond interface. The results demonstrated that the proposed detection scheme can obtain the nonlinear parameters of diffusion-bonded interfaces, and the nonlinear ultrasonic C-scan image of the bond interface is also obtained. The nonlinear parameter in the contact-type defects areas calculated from the bond interface echo is about 10 times (20 dB) higher than that in macro defects areas, whose gap is about 10 μm. The results indicate that the nonlinear ultrasonic methods seem to be more sensitive to contact-type defects and have a great potential to complement the insufficient detection capability of linear ultrasound for diffusion-bonded joints.