Author:
Zou Zhixiang,Chan Kangcheung,Qiao Shunzhi,Zhang Kai,Yue Taiman,Guo Zhongning,Liu Jiangwen
Funder
National Natural Science Foundation of China
Natural Science Foundation of Guangdong Province
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference34 articles.
1. Fabrication of microchannels in glass using focused femtosecond laser radiation and selective chemical etching;Hnatovsky;Appl Phys A-Mater,2006
2. Research on wafer-level MEMS packaging with through-glass vias;Yang;Micromachines,2019
3. Design, fabrication, and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as TSVs in silicon;Sukumaran;IEEE Trans Compon Packag,2014
4. Formation of high aspect ratio through-glass vias by the combination of ultrasonic micromachining and copper electroplating;Pandey;J Manuf Process,2022
5. Micro-machining through electrochemical discharge processes: a review;Kumar;Mater Manuf Process,2020
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献