Author:
Arif Muhammad,Rahman Mustafizur,San Wong Yoke
Subject
Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management
Reference22 articles.
1. Nano scale ductile cutting of brittle materials for wafer fabrication;Kui,2003
2. The Semiconductor Industry Association Report. http://www.businessweek.com [accessed on 01.12.10].
3. Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation;Cai;Int J Mach Tool Manuf,2007
4. Characteristics of ductile mode chip formation in nanoscale cutting of brittle materials;Li;Int J Abrasive Technol,2007
5. Grinding induced subsurface cracks in silicon wafers;Pei;Int J Mach Tool Manuf,1999
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