Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference26 articles.
1. Ductile-regime machining of germanium and silicon;Blake;Journal of American Ceramic Society,1990
2. Energy scaling transitions in machining of silicon by diamond;Puttick;Tribology International,1995
3. Diamond cutting of silicon with nanometric finish;Fang;Annals of the CIRP,1998
4. Diamond turning of silicon substrates in ductile-regime;Leung;Journal of Materials Processing Technology,1998
5. On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications;Yan;Material Science and Engineering A,2001
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