Nonlinear vibration analysis in high speed milling of single crystal silicon considering dynamic cutting thickness-Reference-Cited by-同舟云学术

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Nonlinear vibration analysis in high speed milling of single crystal silicon considering dynamic cutting thickness

Published:2024-07-01 Issue:18 Volume:112 Page:16081-16111
ISSN:0924-090X
Container-title:Nonlinear Dynamics
language:en
Short-container-title:Nonlinear Dyn

Author:

Lu Hang,Li Changyou^ORCID,Liu Chunshi,Hua Chunlei,Hao Jin,Miao Huihui,Xu Mengtao

Funder

National Natural Science Foundation of China

Fundamental Research Funds for Central Universities of the Central South University

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s11071-024-09901-4.pdf

Reference51 articles.

1. Sreejith, P.S., Udupa, G., Noor, Y.B.M.: Recent advances in machining of silicon wafers for semiconductor applications. Int. J. Adv. Manuf. Technol. 17, 157–162 (2001)

2. Pei, Z.J., Fisher, G.R., Liu, J.: Grinding of silicon wafers: a review from historical perspectives. Int. J. Mach. Tools Manuf 48, 1297–1307 (2008)

3. Cai, M.B., Li, X.P., Rahman, M.: Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation. Int. J. Mach. Tools Manuf 47, 75–80 (2007)

4. Huerta, M., Malkin, S.: Grinding of glass: The mechanics of the process. J. Eng. Ind. 98(2), 459–467 (1976)

5. Young, H.T., Liao, H., Huang, H.Y.: Surface integrity of silicon wafers in ultra- precision machining. Int. J. Adv. Manuf. Technol. 29, 372–378 (2006)

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