Recent Advances in Machining of Silicon Wafers for Semiconductor Applications-Reference-Cited by-同舟云学术

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Recent Advances in Machining of Silicon Wafers for Semiconductor Applications

Published:2001-01-01 Issue:3 Volume:17 Page:157-162
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:
Short-container-title:The International Journal of Advanced Manufacturing Technology

Author:

Sreejith P.S.,Udupa G.,Noor Y.B.M.,Ngoi B.K.A.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s001700170185.pdf

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on N-type silicon crystal processing by liquid-immersion wire electrical discharge machining;Materials Science and Engineering: B;2024-07

2. Nonlinear vibration analysis in high speed milling of single crystal silicon considering dynamic cutting thickness;Nonlinear Dynamics;2024-07-01

3. Investigation of machining characterization of solar material on WEDM process through response surface methodology;Journal of the Mechanical Behavior of Materials;2023-01-01

4. Research on N-Type Silicon Crystal Processing by Liquid-Immersion Wire Electrical Discharge Machining;2023

5. Experimental study on improving silicon crystal discharge cutting efficiency based on laser irradiation method;Materials Science in Semiconductor Processing;2022-03

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