Research on factors affecting wear uniformity of the wheels in the double-sided lapping-Reference-Cited by-同舟云学术

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Research on factors affecting wear uniformity of the wheels in the double-sided lapping

Published:2020-02 Issue: Volume:50 Page:653-662
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Lai Zhiyuan,Hu Zhongwei^ORCID,Fang Congfu,Yu Yiqing,xiao Zunhe,Hsieh Pinhui,Chen Mingxin

Funder

National Natural Science Foundation of China

Science and Technology Projects of Xiamen

Fujian Province Regional Development Project in 2019

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference27 articles.

1. Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer;Lee;J Nanosci Nanotechno,2012

2. Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials;Hideo;Curr Appl Phys,2012

3. Simultaneous double side grinding of silicon wafers: a literature review;Li;Int J Mach Tools Manuf.,2006

4. Fine grinding of silicon wafers;Pei;Int J Mach Tools Manuf.,2001

5. Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates;Kim;Wear,2013

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1. Non-linear diamond material removal at increased sliding velocities in ultra-precision grinding;Diamond and Related Materials;2024-04

2. Effect of the vibration displacement responses on end grinding processed surface height;The International Journal of Advanced Manufacturing Technology;2023-11-28

3. Effect of the time domain transient response on processed surface height by the end grinding;2023-07-07

4. Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping;Chinese Journal of Mechanical Engineering;2023-02-08

5. Formation mechanism of concave and convex surface shapes in double-sided lapping;Journal of Materials Processing Technology;2022-11

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