Substrate-Reference-Cited by-同舟云学术

Substrate

Published:2018 Issue: Volume: Page:81-94
ISSN:
Container-title:Wide Bandgap Power Semiconductor Packaging
language:
Short-container-title:

Author:

Hirao Kiyoshi,Zhou You,Miyazaki Hiroyuki

Publisher

Elsevier

Reference21 articles.

1. Emerging capabilities in electronics technologies for extreme environments; part I—high temperature electronics;Mantooth;IEEE Power Electron. Soc. Newsletter,2006

2. Recent advances in wide bandgap power switching devices;Sheng;ECS Trans.,2012

3. Molecular dynamics calculation of the ideal thermal conductivity of single-crystal α-and β-Si3N4;Hirosaki;Phys. Rev. B,2002

4. Thermal conductivity of gas-pressure-sintered silicon nitride;Hirosaki;J. Am. Ceram. Soc.,1996

5. MgSiN2 addition as a means of increasing the thermal conductivity of beta-silicon nitride;Hayashi;J. Am. Ceram. Soc.,2001

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Stress–strain behavior of Cu on the AMB‐Si₃N₄ substrate undergoing thermal cycles via in situ strain measurement;Journal of the American Ceramic Society;2024-08-06

2. Analysis of thermal strain of metallized silicon nitride substrate under cyclic thermal loading by digital image correlation;International Journal of Applied Ceramic Technology;2023-10-10

3. Evaluation of in-plane effective thermal conductivity for metalized ceramic substrates using a micro heater chip;Ceramics International;2023-09

4. Development of the anodized aluminum substrates for thermoelectric energy converters;Ceramics International;2023-02

5. Progress of High Strength and High Thermal Conductivity Si₃N₄ Ceramics for Power Module Packaging;Journal of Inorganic Materials;2023