Author:
Van Den Daele W.,Augendre E.,Le Royer C.,Damlencourt J.-F.,Grandchamp B.,Cristoloveanu S.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. 3D chip stack technology using through-chip interconnects;Benkart;Des Test Comput, IEEE,2005
2. Germanium channel MOSFETs: opportunities and challenges;Shang;IBM J Res Dev,2006
3. High performance 60nm gate length germanium p-MOSFETs with Ni germanide metal source/drain;Yamamoto;IEDM Tech Dig,2007
4. Germanium-on-insulator (GeOI) substrates: a novel engineered substrate for future high performance devices;Akatsu;Mater Sci Semicond Process,2006
5. Electrical characterization of silicon-on-insulator materials and devices;Cristoloveanu,1995
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