Impact of substrate resistivity on spiral inductors at mm-wave frequencies

Author:

Nyssens LucasORCID,Rack Martin,Schwan Christoph,Zhao Zhixing,Lehmann Steffen,Hermann Tom,Allibert Frederic,Aulnette Cécile,Lederer Dimitri,Raskin Jean-Pierre

Funder

FNRS

Innoviris

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. 22nm FDSOI technology for emerging mobile, Internet-of-Things, and RF applications;Carter,2016

2. (Invited) SOI Technologies for RF and Millimeter Wave Applications;Rack;ECS Trans,2019

3. New substrate passivation method dedicated to HR SOI wafer fabrication with increased substrate resistivity;Lederer;IEEE Electron Dev Lett,2005

4. Low-Loss Si-Substrates Enhanced Using Buried PN Junctions for RF Applications;Rack;IEEE Electron Dev Lett,2019

5. Post-process local porous silicon integration method for RF application;Scheen,2019

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1. FD-SOI and RF-SOI technologies for 5G;New Materials and Devices Enabling 5G Applications and Beyond;2024

2. High-resistivity with PN interface passivation in 22 nm FD-SOI technology for low-loss passives at RF and millimeter-wave frequencies;Solid-State Electronics;2023-07

3. PN Junctions Interface Passivation in 22 nm FDSOI for Low-Loss Passives;2022 24th International Microwave and Radar Conference (MIKON);2022-09-12

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