Author:
Foucher B,Boullié J,Meslet B,Das D
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Rebuttal to: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits;Denson;IEEE Trans. Reliab.,1998
2. SAE G-11 Committee, Aerospace information report on reliability prediction methodologies for electronic equipment AIR5286, Electronic reliability prediction sub-committee, 31/01/98
3. Development and activities of the IEEE reliability standards group;Pecht;J. Reliab. Eng. Assoc. Jpn.,2000
4. A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits;Sinnadurai;IEEE Trans. Reliab.,1998
5. A survey of reliability prediction procedures for microelectronic devices;Bowles;IEEE Trans. Reliab.,1992
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