Rebuttal To: A Critique Of The Reliability-analysis-center Failure-rate-model For Plastic Encapsulated Microcircuits
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality
Link
http://xplorestaging.ieee.org/ielx4/24/16397/00756084.pdf?arnumber=756084
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability investigation of exponentiated Weibull distribution using IPL through numerical and artificial neural network modeling;Quality and Reliability Engineering International;2022-06-18
2. Reliability Prediction Methods for Electronic Devices: A State-of-the-art Review;IETE Technical Review;2020-11-12
3. Modeling and Prediction of the Reliability Analysis of an 18-Pulse Rectifier Power Supply for Aircraft Based Applications;IEEE Access;2020
4. Reliability analysis of safety‐critical and control systems: a state‐of‐the‐art review;IET Software;2018-02
5. Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus;Microelectronics Reliability;2009-09
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