Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Solid Logic Technology: Versatile, High-Performance Microelectronics
2. Xie DJ. Thermal fatigue life prediction of BGA solder joints using mechanical fatigue test. GlobalTronics ‘96, Suntec City, Singapore, 7–11 October, 1996: Technical Session 6, 1–6
3. Xie DJ. Final Report of Creep Fatigue Life Test and Assessment for Chip Scale Package and Flip-chip Interconnections, Gintic, 1999
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献