Systematic Verification of BGA Solder Joint Reliability in Multiple Ways

Author:

Lu Wei,Jin Dayuan,Wan Yun

Publisher

Springer Singapore

Reference13 articles.

1. He, Z., Liang, K., Zhou, Q., Gong, G., Wang, X.: BGA soldering quality detection techniques by X ray imaging. Electron. Process Technol. 37(1), 32–39 (2016)

2. Chen, W.U., Wei-yuan, C.H.E.N.: Failure analysis of BGA solder joints based on dye penetrate testing. Mod. Manuf. Eng. 10, 111–114 (2016)

3. Liang, D., Liu, J., Zhou, J.: Improve the reliability of BGA solder joint. Electron. Process Technol. 29(3), 146–148 (2008)

4. Wang, Y., Mo, Y., He, W., Lin, J., Xu, Y., Wan, Y.: Failure analysis on BGA solder joints. Printed Circ. Inf. 2008(7), 61–64 (2008)

5. Li, L., Feng, R., Zhao, S.: Research on mixed joints reliability of lead-free BGA and Sn-Pb solder-paste. Electron. Process Technol. 39(2), 88–91 (2018)

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