Author:
Xie Xin,Jin Dayuan,Wan Yun
Reference9 articles.
1. Interrante, M., Coffin, J., Cole, M.: Lead-free package interconnections for ceramic grid arrays. In: IEEE/CPMT/SEMI 28th Electronics Manufacturing Technology Symposium (2003)
2. IPC-SM-785. Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments. Northbrook, Illinois: IPC (1992)
3. Xie, D.J.: A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill. Microelectron. Reliab. 40(7), 1191–1198 (2000)
4. Lu, L.N., Huang, H.Z., Wu, B.Y., Zhou, Q., Su, X.X., Cai, M.: Investigation of thin small outline package (TSOP) solder joint crack after accelerated thermal cycling testing. In: International Conference on Electronic Packaging Technology & High Density Packaging, pp. 923–926. IEEE (2009)
5. Lall, P., Deshpande, S., Wei, J., Suhling, J.: Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 1449–1456. IEEE (2014)