Analysis of thermal stresses in metal interconnects with multilevel structures-Reference-Cited by-同舟云学术

Analysis of thermal stresses in metal interconnects with multilevel structures

Published:2002-02 Issue:2 Volume:42 Page:259-264
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kilijanski M.S.,Shen Y.-L.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Stress in metal lines under passivation; comparison of experiment with finite element calculations;Greenebaum;Appl Phys Lett,1991

5. Line-width dependence of stress in passivated Al lines during thermal cycling;Chidambarrao,1994

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