Impact of component placement in solder joint reliability-Reference-Cited by-同舟云学术

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Impact of component placement in solder joint reliability

Published:2002-03 Issue:3 Volume:42 Page:399-406
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Alander T,Nurmi S,Heino P,Ristolainen E

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Dean D. Thermal design of electronic circuit boards and packages. Electrochemical Publications Ltd, 1985

2. Ball grid array technologies,1995

3. Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies;Lau,1997

4. Solder bump reliability issues on bump layout;Alander;IEEE Trans Adv Packaging,2000

5. The roles of DNP (distance to neutral point) on solder joint reliability of area array assemblies;Lau;Solder Surf Mount Technol,1997

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Zero-Field Readout Electronics for Planar Fluxgate Sensors Without Compensation Coil;IEEE Transactions on Industrial Electronics;2012-01

2. The effect of PCB surface finish on lead‐free solder joints;Soldering & Surface Mount Technology;2005-03-01

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