Lifetime extrapolation for IGBT modules under realistic operation conditions-Reference-Cited by-同舟云学术

Lifetime extrapolation for IGBT modules under realistic operation conditions

Published:1999-06 Issue:6-7 Volume:39 Page:1131-1136
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ciappa M.,Malberti P.,Fichtner W.,Cova P.,Cattani L.,Fantini F.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Thermal characterization of IGBT power modules;Cova;Microel. Reliab.,1997

2. Advanced IGBT modules for railway traction applications: reliability testing;Berg;Microel. Reliab.,1998

3. On the effect of power cycling stress on IGBT modules;Cova;Microel. Reliab.,1998

4. A 1200 A, 3300 V IGBT power module for traction applications;Dewar,1998

5. Temperature measurements and thermal modeling of highpower IGBT modules;Harnidi;Microel. Reliab.,1998

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