Author:
Cova Paolo,Nicoletto Gianni,Pirondi Alessandro,Portesine Marco,Pasqualetti Maurizio
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. Thermo-mechanical simulation of a multichip press-packed IGBT;Pirondi;Solid State Electronics,1998
5. On the effect of power cycling stress on IGBT modules;Cova;Micr. Reliab.,1998
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