Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Electronic Component Reliability;Jensen,1995
2. Principles of Electronic Pack;Seraphim,1989
3. Thermal Conductivity of plastic encapsulants;Fitzgerald,1996
4. A new Leadframe Design solution for Improved Popcorn Cracking Performance;Lee;IEEE Trans. Comp. Pack. & Manu. Tech.,1998
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献