Finite Element Influence Analysis of Power Module Design Options
Author:
Affiliation:
1. Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany
2. Universal Scientific Industrial Co., Ltd.,Nantou,Taiwan
3. Advanced Semiconductor Engineering, Inc.,Kaohsiung,Taiwan
4. Technical University of Berlin,Berlin,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816738.pdf?arnumber=9816738
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1. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment
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4. Lifetime Evaluation of Nanoscale Silver Sintered Power Modules for Automotive Application Based on Experiments and Finite-Element Modeling
5. Development of life prediction model for lead-free solder at chip resistor
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