Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Author:

Yu Dun-ji,Chen Xu,Chen Gang,Lu Guo-quan,Wang Zheng-qiang

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference15 articles.

1. Microelectronics packaging handbook. Part II: semiconductor packaging;Tummala,1997

2. The changing automotive environment: high-temperature electronics;Johnson;IEEE Trans Electron Package Manuf,2004

3. 6th IEEE CPMT conference on high density microsystem design and packaging and component failure analysis,2004

4. Low temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material;Bai;IEEE Trans Compon Packge Technol,2006

5. Low temperature sintering with nano silver paste in die-attached interconnection;Wang;J Electron Mater,2007

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